The p-i-n diode
- Key People:
- Morris Chang
- Related Topics:
- transistor
- dopant
- p-n junction
- minority carrier injection
- CCD
A p-i-n diode is a p-n junction with an impurity profile tailored so that an intrinsic layer, the “i region,” is sandwiched between a p layer and an n layer. The p-i-n diode has found wide application in microwave circuits. It can be used as a microwave switch with essentially constant depletion-layer capacitance (equal to that of a parallel-plate capacitor having a distance between the plates equal to the i-region thickness) and high power-handling capability.
Bipolar transistors
This type of transistor is one of the most important of the semiconductor devices. It is a bipolar device in that both electrons and holes are involved in the conduction process. The bipolar transistor delivers a change in output current in response to a change in input voltage at the base. The ratio of these two changes has resistance dimensions and is a “transfer” property (input-to-output), hence the name transistor.
A perspective view of a silicon p-n-p bipolar transistor is shown in . Basically the bipolar transistor is fabricated by first forming an n-type region in the p-type substrate; subsequently a p+ region (very heavily doped p-type) is formed in the n region. Ohmic contacts are made to the top p+ and n regions through the windows opened in the oxide layer (an insulator) and to the p region at the bottom.
An idealized, one-dimensional structure of the bipolar transistor, shown in emitter, the narrow central n region is the base, and the p region is the collector. The circuit arrangement in is known as a common-base configuration. The arrows indicate the directions of current flow under normal operating conditions—namely, the emitter-base junction is forward-biased and the base-collector junction is reverse-biased. The complementary structure of the p-n-p bipolar transistor is the n-p-n bipolar transistor, which is obtained by interchanging p for n and n for p in . The current flow and voltage polarity are all reversed. The circuit symbols for p-n-p and n-p-n transistors are given in .
, can be considered as a section of the device along the dashed lines in . The heavily doped p+ region is called theThe bipolar transistor is composed of two closely coupled p-n junctions. The emitter-base p+-n junction is forward-biased and has low resistance. The majority carriers (holes) in the p+-emitter are injected (or emitted) into the base region. The base-collector n-p junction is reverse-biased. It has high resistance, and only a small leakage current will flow across the junction. If the base width is sufficiently narrow, however, most of the holes injected from the emitter can flow through the base and reach the collector. This transport mechanism gives rise to the prevailing nomenclature: emitter, which emits or injects carriers, and collector, which collects these carriers injected from a nearby junction.
The current gain for the common-base configuration is defined as the change in collector current divided by the change in emitter current when the base-to-collector voltage is constant. Typical common-base current gain in a well-designed bipolar transistor is very close to unity. The most useful amplifier circuit is the common-emitter configuration, as shown in , in which a small change in the input current to the base requires little power but can result in much greater current in the output circuit. A typical output current-voltage characteristic for the common-emitter configuration is shown in , where the collector current IC is plotted against the emitter-collector voltage VEC for various base currents. A numerical example is provided using . If VEC is fixed at five volts and the base current IB is varied from 10 to 15 microamperes (μA; 1 μA = 10−6 A), the collector current IC will change from about four to six milliamperes (mA; 1 mA = 10−3 A), as can be read from the left axis. Therefore, an increment of 5 μA in the input-base current gives rise to an increment of 2 mA in the output circuit—an increase of 400 times, with the input signal thus being substantially amplified. In addition to their use as amplifiers, bipolar transistors are key components for oscillators and pulse and analog circuits, as well as for high-speed integrated circuits. There are more than 45,000 types of bipolar transistors for low-frequency operation, with power outputs up to 3,000 watts and a current rating of more than 1,000 amperes. At microwave frequencies, bipolar transistors have power outputs of more than 200 watts at 1 gigahertz and about 10 watts at 10 gigahertz.
Thyristors
The thyristors constitute a family of semiconductor devices that exhibit bistable characteristics and can be switched between a high-resistance, low-current “off” state and a low-resistance, high-current “on” state. The operation of thyristors is intimately related to the bipolar transistor, in which both electrons and holes are involved in the conduction processes. The name thyristor is derived from the electron tube called the gas thyratron, since the electrical characteristics of both devices are similar in many respects. Because of their two stable states (on and off) and low power dissipations in these states, thyristors are used in applications ranging from speed control in home appliances to switching and power conversion in high-voltage transmission lines. More than 40,000 types of thyristors are available, with current ratings from a few milliamperes to more than 5,000 amperes and voltage ratings extending to 900,000 volts.
diffusion step is used to form the p1 and p2 layers simultaneously by diffusing the wafer from both sides. (Diffusion is the movement of impurity atoms into the crystalline structure of a semiconductor.) Finally, n-type impurity atoms are diffused through a ring-shaped window in an oxide into the p2 region to form the n2 layer.
provides a perspective view of a thyristor structure. An n-type wafer is generally chosen as the starting material. Then, aA cross section of the thyristor along the dashed lines is shown in . The thyristor is a four-layer p-n-p-n diode with three p-n junctions in series. The contact electrode to the outer p layer (p1) is called the anode, and that to the outer n layer (n2) is designated the cathode. An additional electrode, known as the gate electrode, is connected to the inner p layer (p2).
The basic current-voltage characteristic of a thyristor is illustrated in
. It exhibits three distinct regions: the forward-blocking (or off) state, the forward-conducting (or on) state, and the reverse-blocking state, which is similar to that of a reverse-biased p-n junction. Thus, a thyristor operated in the forward region is a bistable device that can switch from a high-resistance, low-current off state to a low-resistance, high-current on state, or vice versa.In the forward off state, most of the voltage drops across the centre n1-p2 junction, while in the forward on state all three junctions are forward-biased. The forward current-voltage characteristic can be explained using the method of a two-transistor analog—that is, to consider the device as a p-n-p transistor and an n-p-n transistor connected with the base of one transistor (n1) attached to the collector of the other. As the voltage VAK in enhance the regeneration process, and switch at lower breakover voltages. The effect of gate current on the switching behaviour is shown in (dotted line).
increases from zero, the current IA will increase. This in turn causes the current gains of both transistors to increase. Because of the regenerative nature of these processes, switching eventually occurs, and the device is in its on state. The maximum forward voltage that can be applied to the device prior to switching is called the forward-breakover voltage VBF. The magnitude of VBF depends on the gate current. Higher gate currents cause the current IA to increase faster,A bidirectional, three-terminal thyristor is called a triac. This device can switch the current in either direction by applying a small current of either polarity between the gate and one of the two main terminals. The triac is fabricated by integrating two thyristors in an inverse parallel connection. It is used in AC applications such as light dimming, motor-speed control, and temperature control. There also are many light-activated thyristors that use an optical signal to control the switching behaviour of devices.
Metal-semiconductor field-effect transistors
The metal-semiconductor field-effect transistor (MESFET) is a unipolar device, because its conduction process involves predominantly only one kind of carrier. The MESFET offers many attractive features for applications in both analog and digital circuits. It is particularly useful for microwave amplifications and high-speed integrated circuits, since it can be made from semiconductors with high electron mobilities (e.g., gallium arsenide, whose mobility is five times that of silicon). Because the MESFET is a unipolar device, it does not suffer from minority-carrier effects and so has higher switching speeds and higher operating frequencies than do bipolar transistors.
A perspective view of a MESFET is given in substrate. When a positive voltage is applied to the drain with respect to the source, electrons flow from the source to the drain. Hence, the source serves as the origin of the carriers, and the drain serves as the sink. The third electrode, the gate, forms a rectifying metal-semiconductor contact with the channel. The shaded area underneath the gate electrode is the depletion region of the metal-semiconductor contact. An increase or decrease of the gate voltage with respect to the source causes the depletion region to expand or shrink; this in turn changes the cross-sectional area available for current flow from source to drain. The MESFET thus can be considered a voltage-controlled resistor.
. It consists of a conductive channel with two ohmic contacts, one acting as the source and the other as the drain. The conductive channel is formed in a thin n-type layer supported by a high-resistivity semi-insulating (nonconducting)A typical current-voltage characteristic of a MESFET is shown in
, where the drain current ID is plotted against the drain voltage VD for various gate voltages. For a given gate voltage (e.g., VG = 0), the drain current initially increases linearly with drain voltage, indicating that the conductive channel acts as a constant resistor. As the drain voltage increases, however, the cross-sectional area of the conductive channel is reduced, causing an increase in the channel resistance. As a result, the current increases at a slower rate and eventually saturates. At a given drain voltage the current can be varied by varying the gate voltage. For example, for VD = 5 V, one can increase the current from 0.6 to 0.9 mA by forward-biasing the gate to 0.5 V, as shown in , or one can reduce the current from 0.6 to 0.2 mA by reverse-biasing the gate to −1.0 V.A device related to the MESFET is the junction field-effect transistor (JFET). The JFET, however, has a p-n junction instead of a metal-semiconductor contact for the gate electrode. The operation of a JFET is identical to that of a MESFET.
There are basically four different types of MESFET (or JFET), depending on the type of conductive channel. If, at zero gate bias, a conductive n channel exists and a negative voltage has to be applied to the gate to reduce the channel conductance, as shown in , then the device is an n-channel “normally on” MESFET. If the channel conductance is very low at zero gate bias and a positive voltage must be applied to the gate to form an n channel, then the device is an n-channel “normally off” MESFET. Similarly, p-channel normally on and p-channel normally off MESFETs are available.
To improve the performance of the MESFET, various heterojunction field-effect transistors (FETs) have been developed. A heterojunction is a junction formed between two dissimilar semiconductors, such as the binary compound GaAs and the ternary compound AlxGa1 − xAs. Such junctions have many unique features that are not readily available in the conventional p-n junctions discussed previously.
cross section of a heterojunction FET. The heterojunction is formed between a high-bandgap semiconductor (e.g., Al0.4Ga0.6As, with a bandgap of 1.9 eV) and one of a lower bandgap (e.g., GaAs, with a bandgap of 1.42 eV). By proper control of the bandgaps and the impurity concentrations of these two materials, a conductive channel can be formed at the interface of the two semiconductors. Because of the high conductivity in the conductive channel, a large current can flow through it from source to drain. When a gate voltage is applied, the conductivity of the channel will be changed by the gate bias, which results in a change of drain current. The current-voltage characteristics are similar to those of the MESFET shown in . If the lower-bandgap semiconductor is a high-purity material, the mobility in the conductive channel will be high. This in turn can give rise to higher operating speed.
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